Ved Prakash Gupta

Software Engineer

Bengaluru, Karnataka, India17 yrs 8 mos experience
Most Likely To SwitchHighly Stable

Key Highlights

  • 16+ years of experience in Physical Design
  • Expertise in low power designs and leading teams
  • Successful tape-out of multiple ASICs
Stackforce AI infers this person is a VLSI design expert specializing in ASIC and SOC development.

Contact

Skills

Core Skills

Physical DesignSoc Design Planning

Other Skills

VCLP signoffStatic Timing AnalysisLow-power DesignFloorplanningLECRTL DesignSystem on a Chip (SoC)Clock Tree SynthesisTiming ClosureDRCRouteParasitic ExtractionVLSIASICPhysical Verification

About

 16+ years of extensive experience in Physical design taped out multiple designs in 90/45/32/28/20/14/10/7/5 nm technology.  Currently working on AMD Server Team, contributing FCT setup, FC clock closure, tile closure work from netlist to gds2.  In the previous project(Server Chip) worked on DRC/LVS/timing closure for most critical tiles on entire chip.  Expertise in low power designs and leading low power team for AMD Bangalore site  3 years of experience in graphics and APU (combined CPU an GPU) chips.  Worked for graphics chip with 1.3 million+ gate count have high level of 20lpm design challenges.  Having all industry level tool expertise including ICC2, ICC , Encounter, Primetime, MVRC, VSI,design compiler etc...  Well versed with the complete Gate level Netlist to GDSII design flow, participated in all stages of the design.  Participated in the top/block level full chip timing closure (STA) of multi-million gate ASICs.  Participated in the successful tape-out of two ASICs.  Involved in the physical design (floor planning, place route, CTS) of various ASICs.  Well versed with timing analysis, physical design, synthesis, parasitic extraction, LVS/DRC. Specialties:  ASIC Design Flow and Methodology  Synthesis  Floor plan & Power Planning  Placement & Placement Optimization  Clock tree synthesis  Routing and Routing Optimization  Design for Manufacturing Issues  Physical Verification  Timing Signoff  MVRC  LEC  EM/IR

Experience

17 yrs 8 mos
Total Experience
2 yrs 2 mos
Average Tenure
2 yrs 7 mos
Current Experience

Marvell technology

Principal Engineer

Oct 2023Present · 2 yrs 7 mos · Bengaluru · Hybrid

  • Working on next-gen IPs and Test Chip, which includes N+2 technology IPs.
VCLP signoffPhysical DesignStatic Timing AnalysisSOC design planningLow-power Design

Synopsys (india) eda software pvt ltd

Senior Manager

May 2023Oct 2023 · 5 mos · Bengaluru, Karnataka, India · Hybrid

FloorplanningPhysical DesignStatic Timing AnalysisSOC design planning

Intel corporation

SOC Physical Design Engineer

Apr 2018May 2023 · 5 yrs 1 mo · Bengaluru, Karnataka, India · Hybrid

  • SOC Design planning lead for next-generation Server Graphics.
  • Translate very early architecture proposals and diagrams into floorplan solutions to enable physical implementation, and meet performance goals while minimizing area / power
  • Coordinate placement of all IP’s, high speed IO’s, top level signal planning, and pipelining requirements
  • Work closely with SOC Architects to understand product requirements and guide PD team from floorplanning down to tile implementation and fullchip timing closure to meet all required specs
  • Lead PD/FEINT activities to optimize PPA, targeting area reduction
  • Promote best practices across team and multiple business units
  • Lead engagement with packaging teams to plan power delivery and bumps, as well as constraints related to MCM designs with WLFO. Implement floorplan optimizations to improve power-delivery,
  • Plan out and enable physical reuse across multiple projects to reduce headcount / resources.
  • Work with customer engineering teams on new IPs and propose Physical Design solutions to meet area/timing requirements. Translate high-level specs into actionable PD items.
  • Below are key areas as part of SOC design planning.
  • 1. SOC floorplan owner for next-generation GPU with 750 mm2 area per tile.
  • 2. As part of design planning, I am responsible for area allocation for all subfc/ placement for all
  • major IP which includes hbmio/hsphy/mdfic/mdi/fuse/GT-core.
  • 3. Global fabric planning for complete SOC
  • 4. Directly working with package/PDN to understand HIP placement which has a dependency on
  • package routing.
  • 5. Feedthrough topology --> Creating feedthrough is the most challenging in SOC db. because of
  • complete abutment and multiple star connection and SOC die size.
FloorplanningPhysical DesignStatic Timing AnalysisLECRTL DesignSystem on a Chip (SoC)+1

Amd

2 roles

Member of Technical Staff

Dec 2015Apr 2018 · 2 yrs 4 mos · Bengaluru Area, India

  • Working on FCT setup for the project, handing FC clocks, tiles closer from netlist to gds2 with ICC2 and leading 6 tiles with 2 member team.
  • Worked on different blocks of 14nm server chip.
  • Responsible for End to End activity of challenging modules of AMD 14nm Server chip.
  • Took responsibility for DRC/LVS/Timing closer for most critical tiles on server chip and given back clean database on time.
RTL DesignSystem on a Chip (SoC)Physical DesignSOC design planning

Senior Design Engineer

Jul 2011Dec 2014 · 3 yrs 5 mos · Bengaluru Area, India

  • Leading Low power design checks for full chip level
  • Responsibility added multiple block level designs from Netlist to GDSII
  • Understanding architecture of multiple blocks in detail and performing floor-planning of macros
  • Responsible for MVRC check for DFP blocks as well as full gnb chip using VSI tool.
  • Responsible for writing upf files for Full chip and Block level .
System on a Chip (SoC)Physical Design

Open-silicon, inc.

Lead Asic Design Engineer

Dec 2014Dec 2015 · 1 yr · Bengaluru Area, India

  • End-to-End PD Activities
System on a Chip (SoC)Physical Design

Wipro technologies

Senior Project Engineer (Expertise in Physical Design)

Nov 2010Jul 2011 · 8 mos · Bengaluru Area, India

  • Texas Instruments (Local Onsite)
  • Project Name : Implementation of Micro-controller from Gate level Net list to GDSII.
  •  Responsible for subchip and Chip level activities.
  •  Full responsibility of one subchip includes Floor plan, Power-plan, Placement, Clock Tree synthesis, Routing, Physical Verification (DRC and LVS clean, EM/IR analysis, Pin placement, Congestion map analysis.
  •  Responsible for EM/IR analysis of full chip including manual route at different stages of design.
  •  Responsible for manual routing and Resistance calculation of all the manual routes using Star-RCXT and Spice deck analysis.
  •  Responsible for Geometric verification and Physical verification at top level.
  •  Develop methodology for pin extraction for sub chips from the top level using global router data for reducing the route length and congestion around the sub chips.
  •  Responsible for multi floor plan placement of top level macros and subchip level macros at top level to minimize congestion.
System on a Chip (SoC)Physical Design

Tata consultancy services

Physical Design Engineer

Sep 2008Nov 2010 · 2 yrs 2 mos

  •  2+ years experience in ASIC Physical Design field. Strong Experience in all aspects of IC design including floor planning, power planning, clock tree insertion, place and route, parasitic extraction, Timing Analysis, signal integrity analysis and repair, ECO, Static and Dynamic Voltage drop Analysis and Physical Verification.
  •  Strong Experience in Synopsys Astro, IC Compiler and Prime time for Timing Analysis
  •  Strong experience in high performance digital design, low power design, high speed clock design and distribution
  •  Worked in 0.13u, 90nm technologies having gone through several chip designs from netlist to working silicon
  •  Sound understanding of IC Design Concepts, chip level leakage and dynamic power
  •  Reduction, chip level Integration, Block Timing closure and Chip level crosstalk analysis
  •  Proficient in script writing in Perl and Unix/Linux environment.
  •  Strong knowledge in physical design flow, current and future CMOS processes and DFM rules and their implementation
  •  Experience in low power circuit techniques (Power Gating, Multi VDD)
System on a Chip (SoC)Physical Design

Education

ABV-Indian Institute of Information Technology and Management

Master of Technology (MTech) — VLSI Design

Jan 2006Jan 2008

Uttar Pradesh Technical University

Bachelor of Technology (BTech)

Jan 2002Jan 2006

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